- • 100% Screening (to MIL-PRF 38534 and MIL-PRF 19500)
- • 3D X-ray
- • Acceleration, Vibration & Shock (to MIL-STD-883)
- • ATE and Bench Testing for all Component Parameters
- • Burn-in Life Test
- • Die Shear, Peel Strength & Bond Pull
- • Die Wafer Probing
- • Electrical
- • Electrical Temperature Cycling (-65°C to +150°C)
- • Environmental
- • Fine & Gross Leak (Helium & Fluorocarbon)
- • Gold Wire Bonding
- • Hermetic Sealing
- • High Isolation
- • High Magnification Inspection Stations
- • High Temperature Forcing Stations
- • High Temperature Handlers
- • P.I.N.D.
- • Parallel Gap Welding
- • Pressurisation
- • QCI Group Testing
- • Scanning Electron Microscope (SEM)
- • Solderability
- • Thermal
- • Thermal Vacuum Testing
